SEMICONDUCTOR PACKAGE WITH TWO SUBSTRATES

SEMICONDUCTOR PACKAGE WITH TWO SUBSTRATES

A semiconductor package includes a first substrate having a top surface and a bottom surface, and a second substrate having a top surface and a bottom surface. The bottom surface of the first substrate is connected to the top surface of the second substrate via at least one bonding layer. The first...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: REYNOV, Boris, PREZIOSO, Daniel J, HUTCHINSON, Leif
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package includes a first substrate having a top surface and a bottom surface, and a second substrate having a top surface and a bottom surface. The bottom surface of the first substrate is connected to the top surface of the second substrate via at least one bonding layer. The first substrate includes one or more electrically conductive components arranged on the bottom surface of the first substrate in a first pattern. The second substrate includes one or more slots arranged on the bottom surface of the second substrate in a second pattern. The one or more slots are each plated with an electrically conductive material. The arrangement of the one or more electrically conductive components in the first pattern is aligned with the arrangement of the one or more slots in the second pattern. The second substrate includes a stiffener disposed within the second substrate.