CLEANING AND TRANSFER EQUIPMENT, WAFER TREATMENT EQUIPMENT, TRANSFER EQUIPMENT, AND CLEANING AND TRANSFER METHODS
A cleaning and transfer equipment includes cleaning modules disposed in series, a wafer transport mechanism transporting a wafer between the cleaning modules, and a control device controlling an operation of the wafer transport mechanism. The wafer transport mechanism includes a wafer gripping mecha...
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creator | TOYOSAWA, KOTARO YOSHINARI, DAI |
description | A cleaning and transfer equipment includes cleaning modules disposed in series, a wafer transport mechanism transporting a wafer between the cleaning modules, and a control device controlling an operation of the wafer transport mechanism. The wafer transport mechanism includes a wafer gripping mechanism gripping the wafer, a vertical moving mechanism vertically moving the wafer gripping mechanism, and an arrangement direction moving mechanism moving the wafer gripping mechanism in an arrangement direction of the cleaning modules. The wafer gripping mechanism includes a pair of hands openable and closeable, a rotation mechanism rotating the hands about a rotation shaft parallel to an opening/closing direction, and a sensor measuring a value corresponding to a weight applied to the hands when the hands are in a closed state. The control device compares measurement data of the sensor with a predetermined threshold value to determine whether the wafer is held on the hands. |
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The wafer transport mechanism includes a wafer gripping mechanism gripping the wafer, a vertical moving mechanism vertically moving the wafer gripping mechanism, and an arrangement direction moving mechanism moving the wafer gripping mechanism in an arrangement direction of the cleaning modules. The wafer gripping mechanism includes a pair of hands openable and closeable, a rotation mechanism rotating the hands about a rotation shaft parallel to an opening/closing direction, and a sensor measuring a value corresponding to a weight applied to the hands when the hands are in a closed state. The control device compares measurement data of the sensor with a predetermined threshold value to determine whether the wafer is held on the hands.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING THIN OR FILAMENTARY MATERIAL ; PACKING ; PERFORMING OPERATIONS ; PNEUMATIC TUBE CONVEYORS ; SEMICONDUCTOR DEVICES ; SHOP CONVEYOR SYSTEMS ; STORING ; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241114&DB=EPODOC&CC=US&NR=2024379405A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241114&DB=EPODOC&CC=US&NR=2024379405A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOYOSAWA, KOTARO</creatorcontrib><creatorcontrib>YOSHINARI, DAI</creatorcontrib><title>CLEANING AND TRANSFER EQUIPMENT, WAFER TREATMENT EQUIPMENT, TRANSFER EQUIPMENT, AND CLEANING AND TRANSFER METHODS</title><description>A cleaning and transfer equipment includes cleaning modules disposed in series, a wafer transport mechanism transporting a wafer between the cleaning modules, and a control device controlling an operation of the wafer transport mechanism. The wafer transport mechanism includes a wafer gripping mechanism gripping the wafer, a vertical moving mechanism vertically moving the wafer gripping mechanism, and an arrangement direction moving mechanism moving the wafer gripping mechanism in an arrangement direction of the cleaning modules. The wafer gripping mechanism includes a pair of hands openable and closeable, a rotation mechanism rotating the hands about a rotation shaft parallel to an opening/closing direction, and a sensor measuring a value corresponding to a weight applied to the hands when the hands are in a closed state. 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The wafer transport mechanism includes a wafer gripping mechanism gripping the wafer, a vertical moving mechanism vertically moving the wafer gripping mechanism, and an arrangement direction moving mechanism moving the wafer gripping mechanism in an arrangement direction of the cleaning modules. The wafer gripping mechanism includes a pair of hands openable and closeable, a rotation mechanism rotating the hands about a rotation shaft parallel to an opening/closing direction, and a sensor measuring a value corresponding to a weight applied to the hands when the hands are in a closed state. The control device compares measurement data of the sensor with a predetermined threshold value to determine whether the wafer is held on the hands.</abstract><oa>free_for_read</oa></addata></record> |
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recordid | cdi_epo_espacenet_US2024379405A1 |
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subjects | BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING |
title | CLEANING AND TRANSFER EQUIPMENT, WAFER TREATMENT EQUIPMENT, TRANSFER EQUIPMENT, AND CLEANING AND TRANSFER METHODS |
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