Protection Layer Formation during Plasma Etching Conductive Materials

A method of processing a substrate that includes: forming a patterned hardmask layer over a conductive layer to be etched, the conductive layer disposed over a substrate; and patterning the conductive layer using the patterned hardmask layer as an etch mask, by performing a cyclic plasma etch proces...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Joy, Nicholas, Lu, Yen-Tien, Chang, Shihsheng
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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