CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT BOARD

A circuit board includes a wiring board, a first capacitor, a second capacitor, and a semiconductor device. The first capacitor and the second capacitor are stacked to each other on the wiring board. The semiconductor device is mounted on the wiring board. The first capacitor is provided between the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FUJISAWA, YOSHITOMO, YAMASHITA, NOBUAKI, YAMAGUCHI, HIROYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator FUJISAWA, YOSHITOMO
YAMASHITA, NOBUAKI
YAMAGUCHI, HIROYUKI
description A circuit board includes a wiring board, a first capacitor, a second capacitor, and a semiconductor device. The first capacitor and the second capacitor are stacked to each other on the wiring board. The semiconductor device is mounted on the wiring board. The first capacitor is provided between the second capacitor and the wiring board. A second capacitance of the second capacitor is larger than a first capacitance of the first capacitor.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024365464A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024365464A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024365464A13</originalsourceid><addsrcrecordid>eNrjZPB29gxyDvUMUXDydwxy0VFw9XF1Dgny9_N0VnBxDfN0dtVRcPRzUfB1DfHwd1Hwd1PwdfQLdXN0DgkN8vRzV0DRzcPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4kODjQyMTIzNTE3MTBwNjYlTBQAGeC4x</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT BOARD</title><source>esp@cenet</source><creator>FUJISAWA, YOSHITOMO ; YAMASHITA, NOBUAKI ; YAMAGUCHI, HIROYUKI</creator><creatorcontrib>FUJISAWA, YOSHITOMO ; YAMASHITA, NOBUAKI ; YAMAGUCHI, HIROYUKI</creatorcontrib><description>A circuit board includes a wiring board, a first capacitor, a second capacitor, and a semiconductor device. The first capacitor and the second capacitor are stacked to each other on the wiring board. The semiconductor device is mounted on the wiring board. The first capacitor is provided between the second capacitor and the wiring board. A second capacitance of the second capacitor is larger than a first capacitance of the first capacitor.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241031&amp;DB=EPODOC&amp;CC=US&amp;NR=2024365464A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241031&amp;DB=EPODOC&amp;CC=US&amp;NR=2024365464A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJISAWA, YOSHITOMO</creatorcontrib><creatorcontrib>YAMASHITA, NOBUAKI</creatorcontrib><creatorcontrib>YAMAGUCHI, HIROYUKI</creatorcontrib><title>CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT BOARD</title><description>A circuit board includes a wiring board, a first capacitor, a second capacitor, and a semiconductor device. The first capacitor and the second capacitor are stacked to each other on the wiring board. The semiconductor device is mounted on the wiring board. The first capacitor is provided between the second capacitor and the wiring board. A second capacitance of the second capacitor is larger than a first capacitance of the first capacitor.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB29gxyDvUMUXDydwxy0VFw9XF1Dgny9_N0VnBxDfN0dtVRcPRzUfB1DfHwd1Hwd1PwdfQLdXN0DgkN8vRzV0DRzcPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4kODjQyMTIzNTE3MTBwNjYlTBQAGeC4x</recordid><startdate>20241031</startdate><enddate>20241031</enddate><creator>FUJISAWA, YOSHITOMO</creator><creator>YAMASHITA, NOBUAKI</creator><creator>YAMAGUCHI, HIROYUKI</creator><scope>EVB</scope></search><sort><creationdate>20241031</creationdate><title>CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT BOARD</title><author>FUJISAWA, YOSHITOMO ; YAMASHITA, NOBUAKI ; YAMAGUCHI, HIROYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024365464A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJISAWA, YOSHITOMO</creatorcontrib><creatorcontrib>YAMASHITA, NOBUAKI</creatorcontrib><creatorcontrib>YAMAGUCHI, HIROYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJISAWA, YOSHITOMO</au><au>YAMASHITA, NOBUAKI</au><au>YAMAGUCHI, HIROYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT BOARD</title><date>2024-10-31</date><risdate>2024</risdate><abstract>A circuit board includes a wiring board, a first capacitor, a second capacitor, and a semiconductor device. The first capacitor and the second capacitor are stacked to each other on the wiring board. The semiconductor device is mounted on the wiring board. The first capacitor is provided between the second capacitor and the wiring board. A second capacitance of the second capacitor is larger than a first capacitance of the first capacitor.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2024365464A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T14%3A00%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FUJISAWA,%20YOSHITOMO&rft.date=2024-10-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024365464A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true