STACKED SEMICONDUCTOR STRUCTURE

In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes at least one device on a front side of a semiconductor substrate. A plurality of grating layers are under the at least one device. The plurality of grating layers include at le...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Huang, Cheng Yu, Chou, Keng-Yu, Tseng, Chien-Hsien, Wu, Wen-Hau, Hashimoto, Kazuaki, Chuang, Chun-Hao, Chiang, Wei-Chieh
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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