HEAT STABLE BARRIER FILM STRUCTURE

This disclosure concerns a barrier packaging film including a polyolefin substrate layer having a thickness in the range of from 10 μm to 100 μm, an inorganic coating layer, and a polymeric buffer layer positioned between the polyolefin substrate and the inorganic coating layer, the polymeric buffer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHRISTOPHERSON, Roy, ETTRIDGE, Peter, OKLE, Philipp, LOHWASSER, Wolfgang
Format: Patent
Sprache:eng
Schlagworte:
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