SIDE-WETTABLE SEMICONDUCTOR PACKAGE DEVICE WITH HEAT DISSIPATION SURFACE STRUCTURE

A die of the package device is covered by an encapsulation layer, a plurality of lead portions are configured on the bottom surface of the encapsulation layer, a side portion of each lead portion is also exposed on a side surface of the encapsulation layer, and thereby the package device is used as...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG, Yung-Hui, HUANG, WEN-LIANG, HO, CHUNG-HSIUNG, LI, CHI-HSUEH
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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