VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH BACK-SIDE TRANSFORMERS

VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH BACK-SIDE TRANSFORMERS

Aspects of the present disclosure include systems, structures, circuits, and methods providing integrated circuit (chip) packages or modules having a transformer that is disposed or mounted on or to a side of the lead frame opposite to the related semiconductor dies of the chip package. The transfor...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Taylor, William P
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
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Beschreibung
Zusammenfassung:Aspects of the present disclosure include systems, structures, circuits, and methods providing integrated circuit (chip) packages or modules having a transformer that is disposed or mounted on or to a side of the lead frame opposite to the related semiconductor dies of the chip package. The transformer may be placed on a PCB structure. In some examples, an insulating coating may be placed on the package to increase the isolation capability of the final package. The packages and modules may include various types of circuits; in some examples, chip packages or modules may include a galvanically isolated gate driver or other high voltage circuit.