LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHANICAL ROBUSTNESS AND A SEMICONDUCTOR PACKAGE

A leadframe is disclosed. In one example, the leadframe comprises a die pad and a first lead comprising an inner portion and an external portion. The first lead comprises at least one elevation portion extending over a predetermined length in a longitudinal or lateral direction of the first lead. Th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE, Teck Sim, FINK, Markus, GAN, Thai Kee, FÜRGUT, Edward, CHEE, Guey Yong, BEMMERL, Thomas
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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