LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHANICAL ROBUSTNESS AND A SEMICONDUCTOR PACKAGE

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHANICAL ROBUSTNESS AND A SEMICONDUCTOR PACKAGE

A leadframe is disclosed. In one example, the leadframe comprises a die pad and a first lead comprising an inner portion and an external portion. The first lead comprises at least one elevation portion extending over a predetermined length in a longitudinal or lateral direction of the first lead. Th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE, Teck Sim, FINK, Markus, GAN, Thai Kee, FÜRGUT, Edward, CHEE, Guey Yong, BEMMERL, Thomas
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A leadframe is disclosed. In one example, the leadframe comprises a die pad and a first lead comprising an inner portion and an external portion. The first lead comprises at least one elevation portion extending over a predetermined length in a longitudinal or lateral direction of the first lead. The external portion is configured to be used for external electrical connection. In another example, a semiconductor package having a leadframe is disclosed.