Electrical Connector Using Tunable Hot Melt Adhesive Material
An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit an...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | CHAMPION, Bruce Allen HEMOND, Jessica H B CHIOTA, Jason Thomas BEERS, Megan Hoarfrost MORGAN, Chad William KHAREL, Aakriti ORRIS, David Patrick |
description | An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is adjusted to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024339789A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024339789A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024339789A13</originalsourceid><addsrcrecordid>eNrjZLB1zUlNLinKTE7MUXDOz8sDcvKLFEKLM_PSFUJK8xKTclIVPPJLFHxTc0oUHFMyUoszy1IVfBNLUosyE3N4GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgZGJsbGluYWlo6ExcaoAnUQwnw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electrical Connector Using Tunable Hot Melt Adhesive Material</title><source>esp@cenet</source><creator>CHAMPION, Bruce Allen ; HEMOND, Jessica H B ; CHIOTA, Jason Thomas ; BEERS, Megan Hoarfrost ; MORGAN, Chad William ; KHAREL, Aakriti ; ORRIS, David Patrick</creator><creatorcontrib>CHAMPION, Bruce Allen ; HEMOND, Jessica H B ; CHIOTA, Jason Thomas ; BEERS, Megan Hoarfrost ; MORGAN, Chad William ; KHAREL, Aakriti ; ORRIS, David Patrick</creatorcontrib><description>An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is adjusted to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; CURRENT COLLECTORS ; DYES ; ELECTRICITY ; LINE CONNECTORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241010&DB=EPODOC&CC=US&NR=2024339789A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241010&DB=EPODOC&CC=US&NR=2024339789A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHAMPION, Bruce Allen</creatorcontrib><creatorcontrib>HEMOND, Jessica H B</creatorcontrib><creatorcontrib>CHIOTA, Jason Thomas</creatorcontrib><creatorcontrib>BEERS, Megan Hoarfrost</creatorcontrib><creatorcontrib>MORGAN, Chad William</creatorcontrib><creatorcontrib>KHAREL, Aakriti</creatorcontrib><creatorcontrib>ORRIS, David Patrick</creatorcontrib><title>Electrical Connector Using Tunable Hot Melt Adhesive Material</title><description>An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is adjusted to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>CURRENT COLLECTORS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB1zUlNLinKTE7MUXDOz8sDcvKLFEKLM_PSFUJK8xKTclIVPPJLFHxTc0oUHFMyUoszy1IVfBNLUosyE3N4GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgZGJsbGluYWlo6ExcaoAnUQwnw</recordid><startdate>20241010</startdate><enddate>20241010</enddate><creator>CHAMPION, Bruce Allen</creator><creator>HEMOND, Jessica H B</creator><creator>CHIOTA, Jason Thomas</creator><creator>BEERS, Megan Hoarfrost</creator><creator>MORGAN, Chad William</creator><creator>KHAREL, Aakriti</creator><creator>ORRIS, David Patrick</creator><scope>EVB</scope></search><sort><creationdate>20241010</creationdate><title>Electrical Connector Using Tunable Hot Melt Adhesive Material</title><author>CHAMPION, Bruce Allen ; HEMOND, Jessica H B ; CHIOTA, Jason Thomas ; BEERS, Megan Hoarfrost ; MORGAN, Chad William ; KHAREL, Aakriti ; ORRIS, David Patrick</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024339789A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CURRENT COLLECTORS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHAMPION, Bruce Allen</creatorcontrib><creatorcontrib>HEMOND, Jessica H B</creatorcontrib><creatorcontrib>CHIOTA, Jason Thomas</creatorcontrib><creatorcontrib>BEERS, Megan Hoarfrost</creatorcontrib><creatorcontrib>MORGAN, Chad William</creatorcontrib><creatorcontrib>KHAREL, Aakriti</creatorcontrib><creatorcontrib>ORRIS, David Patrick</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHAMPION, Bruce Allen</au><au>HEMOND, Jessica H B</au><au>CHIOTA, Jason Thomas</au><au>BEERS, Megan Hoarfrost</au><au>MORGAN, Chad William</au><au>KHAREL, Aakriti</au><au>ORRIS, David Patrick</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electrical Connector Using Tunable Hot Melt Adhesive Material</title><date>2024-10-10</date><risdate>2024</risdate><abstract>An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is adjusted to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US2024339789A1 |
source | esp@cenet |
subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY CURRENT COLLECTORS DYES ELECTRICITY LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
title | Electrical Connector Using Tunable Hot Melt Adhesive Material |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-17T22%3A37%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHAMPION,%20Bruce%20Allen&rft.date=2024-10-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024339789A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |