SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

A semiconductor device includes a first semiconductor structure including a first substrate, and a lower bonding structure on the first substrate, and a second semiconductor structure including a second substrate, and an upper bonding structure bonded to the lower bonding structure. The second semic...

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Hauptverfasser: Lee, Minhee, Jang, Yunsun, Jeong, Hayoung, Kim, Taeyong, Choi, Moorym, Shim, Sunil
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creator Lee, Minhee
Jang, Yunsun
Jeong, Hayoung
Kim, Taeyong
Choi, Moorym
Shim, Sunil
description A semiconductor device includes a first semiconductor structure including a first substrate, and a lower bonding structure on the first substrate, and a second semiconductor structure including a second substrate, and an upper bonding structure bonded to the lower bonding structure. The second semiconductor structure includes via patterns on the second substrate, a source contact pad including a material different from that of the second substrate, a source contact plug electrically connected to the source contact pad, a source contact via on the source contact pad, and an interconnection line that electrically connects the via patterns to the source contact plug. Lower surfaces of the via patterns are farther from the first substrate than a lower surface of the source contact via, and an upper surface of the second substrate is farther from the first substrate than an upper surface of the source contact pad.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
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