ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE

An electronic assembly has a circuit board and two or more heat sinks arranged on the printed circuit board, each having a straight air duct section from an air inlet opening of the heat sink to an air outlet opening of the heat sink. The heat sinks are spaced apart from each other one behind anothe...

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Hauptverfasser: Heimler, Martin, Breiter, Julian Stefan, Müller, Nina, Eisner, Matthias
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creator Heimler, Martin
Breiter, Julian Stefan
Müller, Nina
Eisner, Matthias
description An electronic assembly has a circuit board and two or more heat sinks arranged on the printed circuit board, each having a straight air duct section from an air inlet opening of the heat sink to an air outlet opening of the heat sink. The heat sinks are spaced apart from each other one behind another in a row by intervening spaces, with their air duct sections lying in a straight line and forming an air duct. Through-hole-mounted THT components, which in each case rest against an outside surface of one of the heat sinks, have connecting pins secured in the printed circuit board. A fan generates an air stream that enters the air inlet opening of the heat sink that is located at the beginning of the row and flows through the air duct.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024334587A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024334587A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024334587A13</originalsourceid><addsrcrecordid>eNrjZDBz9XF1Dgny9_N0VnAMDnb1dfKJVHD0c1EAMj2d_f1cQp1D_IMUgsM9Q5w9PP3cFVxcwzydXXkYWNMSc4pTeaE0N4OymytQhW5qQX58anFBYnJqXmpJfGiwkYGRibGxiamFuaOhMXGqAMyRKRc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE</title><source>esp@cenet</source><creator>Heimler, Martin ; Breiter, Julian Stefan ; Müller, Nina ; Eisner, Matthias</creator><creatorcontrib>Heimler, Martin ; Breiter, Julian Stefan ; Müller, Nina ; Eisner, Matthias</creatorcontrib><description>An electronic assembly has a circuit board and two or more heat sinks arranged on the printed circuit board, each having a straight air duct section from an air inlet opening of the heat sink to an air outlet opening of the heat sink. The heat sinks are spaced apart from each other one behind another in a row by intervening spaces, with their air duct sections lying in a straight line and forming an air duct. Through-hole-mounted THT components, which in each case rest against an outside surface of one of the heat sinks, have connecting pins secured in the printed circuit board. A fan generates an air stream that enters the air inlet opening of the heat sink that is located at the beginning of the row and flows through the air duct.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241003&amp;DB=EPODOC&amp;CC=US&amp;NR=2024334587A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241003&amp;DB=EPODOC&amp;CC=US&amp;NR=2024334587A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Heimler, Martin</creatorcontrib><creatorcontrib>Breiter, Julian Stefan</creatorcontrib><creatorcontrib>Müller, Nina</creatorcontrib><creatorcontrib>Eisner, Matthias</creatorcontrib><title>ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE</title><description>An electronic assembly has a circuit board and two or more heat sinks arranged on the printed circuit board, each having a straight air duct section from an air inlet opening of the heat sink to an air outlet opening of the heat sink. The heat sinks are spaced apart from each other one behind another in a row by intervening spaces, with their air duct sections lying in a straight line and forming an air duct. Through-hole-mounted THT components, which in each case rest against an outside surface of one of the heat sinks, have connecting pins secured in the printed circuit board. A fan generates an air stream that enters the air inlet opening of the heat sink that is located at the beginning of the row and flows through the air duct.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBz9XF1Dgny9_N0VnAMDnb1dfKJVHD0c1EAMj2d_f1cQp1D_IMUgsM9Q5w9PP3cFVxcwzydXXkYWNMSc4pTeaE0N4OymytQhW5qQX58anFBYnJqXmpJfGiwkYGRibGxiamFuaOhMXGqAMyRKRc</recordid><startdate>20241003</startdate><enddate>20241003</enddate><creator>Heimler, Martin</creator><creator>Breiter, Julian Stefan</creator><creator>Müller, Nina</creator><creator>Eisner, Matthias</creator><scope>EVB</scope></search><sort><creationdate>20241003</creationdate><title>ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE</title><author>Heimler, Martin ; Breiter, Julian Stefan ; Müller, Nina ; Eisner, Matthias</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024334587A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Heimler, Martin</creatorcontrib><creatorcontrib>Breiter, Julian Stefan</creatorcontrib><creatorcontrib>Müller, Nina</creatorcontrib><creatorcontrib>Eisner, Matthias</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Heimler, Martin</au><au>Breiter, Julian Stefan</au><au>Müller, Nina</au><au>Eisner, Matthias</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE</title><date>2024-10-03</date><risdate>2024</risdate><abstract>An electronic assembly has a circuit board and two or more heat sinks arranged on the printed circuit board, each having a straight air duct section from an air inlet opening of the heat sink to an air outlet opening of the heat sink. The heat sinks are spaced apart from each other one behind another in a row by intervening spaces, with their air duct sections lying in a straight line and forming an air duct. Through-hole-mounted THT components, which in each case rest against an outside surface of one of the heat sinks, have connecting pins secured in the printed circuit board. A fan generates an air stream that enters the air inlet opening of the heat sink that is located at the beginning of the row and flows through the air duct.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T16%3A12%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Heimler,%20Martin&rft.date=2024-10-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024334587A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true