PACKAGE STRUCTURE

A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configure...

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Hauptverfasser: TING, Chun-Yen, KANG, Jung Jui, LEE, Chiu-Wen, SUN, Shih-Yuan, WU, Po-I, KUO, Hung-Chun
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creator TING, Chun-Yen
KANG, Jung Jui
LEE, Chiu-Wen
SUN, Shih-Yuan
WU, Po-I
KUO, Hung-Chun
description A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024332192A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024332192A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024332192A13</originalsourceid><addsrcrecordid>eNrjZBAMcHT2dnR3VQgOCQp1DgkNcuVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRibGxkaGlkaOhsbEqQIAnOEewQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PACKAGE STRUCTURE</title><source>esp@cenet</source><creator>TING, Chun-Yen ; KANG, Jung Jui ; LEE, Chiu-Wen ; SUN, Shih-Yuan ; WU, Po-I ; KUO, Hung-Chun</creator><creatorcontrib>TING, Chun-Yen ; KANG, Jung Jui ; LEE, Chiu-Wen ; SUN, Shih-Yuan ; WU, Po-I ; KUO, Hung-Chun</creatorcontrib><description>A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241003&amp;DB=EPODOC&amp;CC=US&amp;NR=2024332192A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241003&amp;DB=EPODOC&amp;CC=US&amp;NR=2024332192A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TING, Chun-Yen</creatorcontrib><creatorcontrib>KANG, Jung Jui</creatorcontrib><creatorcontrib>LEE, Chiu-Wen</creatorcontrib><creatorcontrib>SUN, Shih-Yuan</creatorcontrib><creatorcontrib>WU, Po-I</creatorcontrib><creatorcontrib>KUO, Hung-Chun</creatorcontrib><title>PACKAGE STRUCTURE</title><description>A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMcHT2dnR3VQgOCQp1DgkNcuVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRibGxkaGlkaOhsbEqQIAnOEewQ</recordid><startdate>20241003</startdate><enddate>20241003</enddate><creator>TING, Chun-Yen</creator><creator>KANG, Jung Jui</creator><creator>LEE, Chiu-Wen</creator><creator>SUN, Shih-Yuan</creator><creator>WU, Po-I</creator><creator>KUO, Hung-Chun</creator><scope>EVB</scope></search><sort><creationdate>20241003</creationdate><title>PACKAGE STRUCTURE</title><author>TING, Chun-Yen ; KANG, Jung Jui ; LEE, Chiu-Wen ; SUN, Shih-Yuan ; WU, Po-I ; KUO, Hung-Chun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024332192A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TING, Chun-Yen</creatorcontrib><creatorcontrib>KANG, Jung Jui</creatorcontrib><creatorcontrib>LEE, Chiu-Wen</creatorcontrib><creatorcontrib>SUN, Shih-Yuan</creatorcontrib><creatorcontrib>WU, Po-I</creatorcontrib><creatorcontrib>KUO, Hung-Chun</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TING, Chun-Yen</au><au>KANG, Jung Jui</au><au>LEE, Chiu-Wen</au><au>SUN, Shih-Yuan</au><au>WU, Po-I</au><au>KUO, Hung-Chun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PACKAGE STRUCTURE</title><date>2024-10-03</date><risdate>2024</risdate><abstract>A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
title PACKAGE STRUCTURE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T20%3A43%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TING,%20Chun-Yen&rft.date=2024-10-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024332192A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true