REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE

A system and method are provided for energy monitoring. The system and method include a trace current sensor formed on a first printed circuit board (PCB) substrate around at an opening of the first PCB substrate. The opening is configured to receive a portion of an electrical conductor to be monito...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Fischels, Collin Richard, Melecio Ramirez, Juan Ignacio, Rendon Hernandez, Adrian Abdala
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Fischels, Collin Richard
Melecio Ramirez, Juan Ignacio
Rendon Hernandez, Adrian Abdala
description A system and method are provided for energy monitoring. The system and method include a trace current sensor formed on a first printed circuit board (PCB) substrate around at an opening of the first PCB substrate. The opening is configured to receive a portion of an electrical conductor to be monitored by the sensor. The system and method also include a signal conditioner for conditioning an output signal from the sensor. The output signal corresponds to a measurement of current on the conductor. The system and method can further include a processor(s) for measuring energy usage of load(s) connected to the conductor based on the current measurement. The signal conditioner and/or the processor(s) are either on the first PCB substrate or on a separate second PCB substrate which is connected to the first PCB substrate across a flexible connector.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024329090A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024329090A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024329090A13</originalsourceid><addsrcrecordid>eNrjZHAOcnUJdXZ10XUO8g8ODnH08dZR8PQLcXUPcgxxdVHw8Q_XDQjyd_P0cVVwDg0KcvULUQh29Qv2D1IIcHZS8PV3CfVx5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGJsZGlgaWBo6GxsSpAgDykCyW</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE</title><source>esp@cenet</source><creator>Fischels, Collin Richard ; Melecio Ramirez, Juan Ignacio ; Rendon Hernandez, Adrian Abdala</creator><creatorcontrib>Fischels, Collin Richard ; Melecio Ramirez, Juan Ignacio ; Rendon Hernandez, Adrian Abdala</creatorcontrib><description>A system and method are provided for energy monitoring. The system and method include a trace current sensor formed on a first printed circuit board (PCB) substrate around at an opening of the first PCB substrate. The opening is configured to receive a portion of an electrical conductor to be monitored by the sensor. The system and method also include a signal conditioner for conditioning an output signal from the sensor. The output signal corresponds to a measurement of current on the conductor. The system and method can further include a processor(s) for measuring energy usage of load(s) connected to the conductor based on the current measurement. The signal conditioner and/or the processor(s) are either on the first PCB substrate or on a separate second PCB substrate which is connected to the first PCB substrate across a flexible connector.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; PRINTED CIRCUITS ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241003&amp;DB=EPODOC&amp;CC=US&amp;NR=2024329090A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241003&amp;DB=EPODOC&amp;CC=US&amp;NR=2024329090A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Fischels, Collin Richard</creatorcontrib><creatorcontrib>Melecio Ramirez, Juan Ignacio</creatorcontrib><creatorcontrib>Rendon Hernandez, Adrian Abdala</creatorcontrib><title>REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE</title><description>A system and method are provided for energy monitoring. The system and method include a trace current sensor formed on a first printed circuit board (PCB) substrate around at an opening of the first PCB substrate. The opening is configured to receive a portion of an electrical conductor to be monitored by the sensor. The system and method also include a signal conditioner for conditioning an output signal from the sensor. The output signal corresponds to a measurement of current on the conductor. The system and method can further include a processor(s) for measuring energy usage of load(s) connected to the conductor based on the current measurement. The signal conditioner and/or the processor(s) are either on the first PCB substrate or on a separate second PCB substrate which is connected to the first PCB substrate across a flexible connector.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAOcnUJdXZ10XUO8g8ODnH08dZR8PQLcXUPcgxxdVHw8Q_XDQjyd_P0cVVwDg0KcvULUQh29Qv2D1IIcHZS8PV3CfVx5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGJsZGlgaWBo6GxsSpAgDykCyW</recordid><startdate>20241003</startdate><enddate>20241003</enddate><creator>Fischels, Collin Richard</creator><creator>Melecio Ramirez, Juan Ignacio</creator><creator>Rendon Hernandez, Adrian Abdala</creator><scope>EVB</scope></search><sort><creationdate>20241003</creationdate><title>REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE</title><author>Fischels, Collin Richard ; Melecio Ramirez, Juan Ignacio ; Rendon Hernandez, Adrian Abdala</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024329090A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Fischels, Collin Richard</creatorcontrib><creatorcontrib>Melecio Ramirez, Juan Ignacio</creatorcontrib><creatorcontrib>Rendon Hernandez, Adrian Abdala</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Fischels, Collin Richard</au><au>Melecio Ramirez, Juan Ignacio</au><au>Rendon Hernandez, Adrian Abdala</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE</title><date>2024-10-03</date><risdate>2024</risdate><abstract>A system and method are provided for energy monitoring. The system and method include a trace current sensor formed on a first printed circuit board (PCB) substrate around at an opening of the first PCB substrate. The opening is configured to receive a portion of an electrical conductor to be monitored by the sensor. The system and method also include a signal conditioner for conditioning an output signal from the sensor. The output signal corresponds to a measurement of current on the conductor. The system and method can further include a processor(s) for measuring energy usage of load(s) connected to the conductor based on the current measurement. The signal conditioner and/or the processor(s) are either on the first PCB substrate or on a separate second PCB substrate which is connected to the first PCB substrate across a flexible connector.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2024329090A1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRINTED CIRCUITS
TESTING
title REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T23%3A05%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Fischels,%20Collin%20Richard&rft.date=2024-10-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024329090A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true