WAFER THINNING METHOD

A wafer thinning method for a wafer includes bonding a first support substrate to a first surface of the wafer, positioning a focused spot of a laser beam with a wavelength transmittable through the wafer from a second surface side of the wafer inside the wafer, and applying the laser beam while mov...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NOMOTO, Asahi
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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