SEMICONDUCTOR DEVICE MANUFACTURING ON ASSEMBLED WAFER
Semiconductor structures and processes of forming the same are provided. A semiconductor structure according to the present disclosure includes a first bottom source/drain feature and a second bottom source/drain feature disposed over a substrate, a plurality of bottom channel members extending betw...
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| creator | Tsai, Chen-Fong Yang, Ku-Feng Hu, Kuan-Kan Chen, Han-De Chui, Chi On |
| description | Semiconductor structures and processes of forming the same are provided. A semiconductor structure according to the present disclosure includes a first bottom source/drain feature and a second bottom source/drain feature disposed over a substrate, a plurality of bottom channel members extending between and in contact with the first bottom source/drain feature and the second bottom source/drain feature, a first bonding layer over the plurality of bottom channel members, a second bonding layer disposed directly on the first bonding layer, a first top source/drain feature disposed directly over the first bottom source/drain feature, a second top source/drain feature disposed directly over the second bottom source/drain feature, and a plurality of top channel members disposed over the second bonding layer and extending between and in contact with the first top source/drain feature and the second top source/drain feature. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR DEVICE MANUFACTURING ON ASSEMBLED WAFER |
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