SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

A semiconductor package includes an upper redistribution structure, a first substrate, a first semiconductor chip, a second semiconductor chip, a bridge chip, and a first insulating layer. The upper redistribution structure includes an upper redistribution insulating layer and upper redistribution patterns. The first substrate includes an upper surface, a lower surface, a first cavity extending in a vertical direction, and a second cavity provided apart from the first cavity in a horizontal direction and extending in the vertical direction. The first substrate is on an upper surface of the upper redistribution structure. The first semiconductor chip is accommodated in the first cavity and electrically connected to a subset of the upper redistribution patterns. The second semiconductor chip is accommodated in the second cavity and electrically connected to a subset of the upper redistribution patterns. The bridge chip is below the upper redistribution structure. The first insulating layer surrounds the bridge chip.