SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING UNIT

SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING UNIT

This semiconductor light emitting device comprises: a substrate that has a substrate front surface, a substrate back surface, and substrate lateral surfaces; front-surface-side wiring; back-surface-side wiring; and a semiconductor light emitting element that has a light emitting element lateral surf...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SAKAMOTO, Koki
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SAKAMOTO, Koki
description This semiconductor light emitting device comprises: a substrate that has a substrate front surface, a substrate back surface, and substrate lateral surfaces; front-surface-side wiring; back-surface-side wiring; and a semiconductor light emitting element that has a light emitting element lateral surface as a light emitting surface. The substrate lateral surfaces include a first substrate lateral surface which faces the same side as the light emitting element lateral surface that is a light emitting surface, and a second substrate lateral surface on the reverse side from the first substrate lateral surface. The semiconductor light emitting element is disposed so as to be offset more toward the first substrate lateral surface than the second substrate lateral surface. Provided to the first substrate lateral surface is an end surface through hole which passes through the substrate in the thickness direction of the substrate and which connects the front-surface-side wiring and the back-surface-side wiring.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024313501A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024313501A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024313501A13</originalsourceid><addsrcrecordid>eNrjZPAMdvX1dPb3cwl1DvEPUvDxdPcIUQAKhYR4-rkruLiGeTq7Kjj6uSjgVRfq5xnCw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkviQ4ONDIxMjA2NTQ0MHQ2NiVMFAAtnLkE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING UNIT</title><source>esp@cenet</source><creator>SAKAMOTO, Koki</creator><creatorcontrib>SAKAMOTO, Koki</creatorcontrib><description>This semiconductor light emitting device comprises: a substrate that has a substrate front surface, a substrate back surface, and substrate lateral surfaces; front-surface-side wiring; back-surface-side wiring; and a semiconductor light emitting element that has a light emitting element lateral surface as a light emitting surface. The substrate lateral surfaces include a first substrate lateral surface which faces the same side as the light emitting element lateral surface that is a light emitting surface, and a second substrate lateral surface on the reverse side from the first substrate lateral surface. The semiconductor light emitting element is disposed so as to be offset more toward the first substrate lateral surface than the second substrate lateral surface. Provided to the first substrate lateral surface is an end surface through hole which passes through the substrate in the thickness direction of the substrate and which connects the front-surface-side wiring and the back-surface-side wiring.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRICITY</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240919&amp;DB=EPODOC&amp;CC=US&amp;NR=2024313501A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240919&amp;DB=EPODOC&amp;CC=US&amp;NR=2024313501A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAMOTO, Koki</creatorcontrib><title>SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING UNIT</title><description>This semiconductor light emitting device comprises: a substrate that has a substrate front surface, a substrate back surface, and substrate lateral surfaces; front-surface-side wiring; back-surface-side wiring; and a semiconductor light emitting element that has a light emitting element lateral surface as a light emitting surface. The substrate lateral surfaces include a first substrate lateral surface which faces the same side as the light emitting element lateral surface that is a light emitting surface, and a second substrate lateral surface on the reverse side from the first substrate lateral surface. The semiconductor light emitting element is disposed so as to be offset more toward the first substrate lateral surface than the second substrate lateral surface. Provided to the first substrate lateral surface is an end surface through hole which passes through the substrate in the thickness direction of the substrate and which connects the front-surface-side wiring and the back-surface-side wiring.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAMdvX1dPb3cwl1DvEPUvDxdPcIUQAKhYR4-rkruLiGeTq7Kjj6uSjgVRfq5xnCw8CalphTnMoLpbkZlN1cQ5w9dFML8uNTiwsSk1PzUkviQ4ONDIxMjA2NTQ0MHQ2NiVMFAAtnLkE</recordid><startdate>20240919</startdate><enddate>20240919</enddate><creator>SAKAMOTO, Koki</creator><scope>EVB</scope></search><sort><creationdate>20240919</creationdate><title>SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING UNIT</title><author>SAKAMOTO, Koki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024313501A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAMOTO, Koki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAMOTO, Koki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING UNIT</title><date>2024-09-19</date><risdate>2024</risdate><abstract>This semiconductor light emitting device comprises: a substrate that has a substrate front surface, a substrate back surface, and substrate lateral surfaces; front-surface-side wiring; back-surface-side wiring; and a semiconductor light emitting element that has a light emitting element lateral surface as a light emitting surface. The substrate lateral surfaces include a first substrate lateral surface which faces the same side as the light emitting element lateral surface that is a light emitting surface, and a second substrate lateral surface on the reverse side from the first substrate lateral surface. The semiconductor light emitting element is disposed so as to be offset more toward the first substrate lateral surface than the second substrate lateral surface. Provided to the first substrate lateral surface is an end surface through hole which passes through the substrate in the thickness direction of the substrate and which connects the front-surface-side wiring and the back-surface-side wiring.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2024313501A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
title SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING UNIT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T21%3A16%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAKAMOTO,%20Koki&rft.date=2024-09-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024313501A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true