FIDUCIAL DESIGN OPTIMIZATION FOR LAND SIDE DEVICE ANYWHERE PACKAGE ASSEMBLY

Microelectronic devices, systems, and techniques are disclosed having package substrate land side fiducial structures that are readily distinguishable from adjacent interconnect structures during registration of the land side of the package substrate. The fiducial structure includes a ring shape, a...

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Hauptverfasser:	Pietambaram, Srinivas, Han, Jung Kyu, Deshpande, Shishir, Duan, Gang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	Pietambaram, Srinivas Han, Jung Kyu Deshpande, Shishir Duan, Gang
description	Microelectronic devices, systems, and techniques are disclosed having package substrate land side fiducial structures that are readily distinguishable from adjacent interconnect structures during registration of the land side of the package substrate. The fiducial structure includes a ring shape, a double ring shape, a donut shape, a triangular shape, an H-shape, or an I-shape in contrast to the circular, square, or rectangular shape of the adjacent interconnect structure. The fiducial structure shape may also have a different size relative to the interconnect structure shape.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	FIDUCIAL DESIGN OPTIMIZATION FOR LAND SIDE DEVICE ANYWHERE PACKAGE ASSEMBLY
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