SEMICONDUCTOR PACKAGES

A semiconductor package includes a redistribution substrate that includes a first redistribution pattern and a second redistribution pattern that are at different levels from each other, and a semiconductor chip on the redistribution substrate and including a plurality of chip pads electrically conn...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHUN, Jinho, AN, Jin Ho, PARK, Jumyong, CHOI, Ju-Il, LEE, Chungsun, OH, Dongjoon, JIN, Jeonggi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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