SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

An interconnection structure, along with methods of forming such, are described. The structure includes a dielectric layer, a first conductive feature disposed in the dielectric layer, and a conductive layer disposed over the dielectric layer. The conductive layer includes a first portion and a seco...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TENG, Chi-Lin, SHUE, Shau-Lin, CHANG, Hsiaokang, HUANG, Hsin-Yen, LEE, Shao-Kuan, LO, Ting-Ya, LEE, Cheng-Chin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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