FLAMEPROOF POLYAMIDE MOLDING COMPOUNDS FOR INSULATING ELECTRIC COMPONENTS

FLAMEPROOF POLYAMIDE MOLDING COMPOUNDS FOR INSULATING ELECTRIC COMPONENTS

A flame-retardant polyamide molding compound may have low phosphorus content. Such a polyamide molding compound may include (A) a polyamide matrix including polyamide(s) having at least 8 carbon atoms per amide unit; (B) a flame retardant composition comprising (B1) metal-free aryl phosphate(s), (B2...

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Hauptverfasser: SZENTIVANYI, Andreas, PHAM, Duy Vu, MERKULOV, Alexey, FRANOSCH, Juergen, RUBAN, Eckart, RESING, Mario
Format: Patent
Sprache:eng
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CHEMISTRY
COMPOSITIONS BASED THEREON
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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creator SZENTIVANYI, Andreas
PHAM, Duy Vu
MERKULOV, Alexey
FRANOSCH, Juergen
RUBAN, Eckart
RESING, Mario
description A flame-retardant polyamide molding compound may have low phosphorus content. Such a polyamide molding compound may include (A) a polyamide matrix including polyamide(s) having at least 8 carbon atoms per amide unit; (B) a flame retardant composition comprising (B1) metal-free aryl phosphate(s), (B2) aryl phosphonate(s), (B3) carbohydrate polyol(s), (B4) melamine cyanurate(s), and (B5) optionally, non-phosphorus-comprising flame retardant(s). A total phosphorus content from the flame retardant composition may be in a range of from 0.5 to 1.5 wt. %, based on total polyamide molding compound weight
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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title FLAMEPROOF POLYAMIDE MOLDING COMPOUNDS FOR INSULATING ELECTRIC COMPONENTS
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