LIGHT-EMITTING CHIP, LIGHT-EMITTING SUBSTRATE, DISPLAY DEVICE, AND MANUFACTURING METHOD FOR LIGHT-EMITTING SUBSTRATE

LIGHT-EMITTING CHIP, LIGHT-EMITTING SUBSTRATE, DISPLAY DEVICE, AND MANUFACTURING METHOD FOR LIGHT-EMITTING SUBSTRATE

Provided are a light-emitting chip, a light-emitting substrate, a display device, and a manufacturing method for a light-emitting substrate. The light-emitting chip includes: a substrate; a light-emitting structure, the light-emitting structure disposed on a side of the substrate; a reflective layer...

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Hauptverfasser: SUN, Liang, ZHOU, Qiqi, WANG, Le, QI, Jiacheng, DONG, Enkai, FENG, Sha, LU, Yuanda, XIONG, Zhijun, LI, Zhaohui, LI, Jinpeng, CHU, Yutian
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SUN, Liang
ZHOU, Qiqi
WANG, Le
QI, Jiacheng
DONG, Enkai
FENG, Sha
LU, Yuanda
XIONG, Zhijun
LI, Zhaohui
LI, Jinpeng
CHU, Yutian
description Provided are a light-emitting chip, a light-emitting substrate, a display device, and a manufacturing method for a light-emitting substrate. The light-emitting chip includes: a substrate; a light-emitting structure, the light-emitting structure disposed on a side of the substrate; a reflective layer disposed on a side, facing away from the substrate, of the light-emitting structure; at least two sub-light-emitting auxiliary bonding layers disposed on a side, facing away from the light-emitting structure, of the reflective layer; and a raised portion, disposed on a side, facing away from the light-emitting structure, of the reflective layer, an orthographic projection of the raised portion on the substrate and an orthographic projection of the sub-light-emitting auxiliary bonding layers on the substrate do not overlap with each other, and a thickness of the raised portion is smaller than a thickness of each of the at least two sub-light-emitting auxiliary bonding layers.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LIGHT-EMITTING CHIP, LIGHT-EMITTING SUBSTRATE, DISPLAY DEVICE, AND MANUFACTURING METHOD FOR LIGHT-EMITTING SUBSTRATE
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