CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE

A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a buffer structure penetrating into the substrate. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The chip pac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN, Po-Yao, LAI, Po-Chen, CHEN, Ping-Tai, WANG, Chin-Hua, LIN, Yu-Sheng, JENG, Shin-Puu, YANG, Che-Chia
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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