SEMICONDUCTOR DEVICE

A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element electrically connected to the first semiconductor element and the second semiconductor element, and insulating the first semiconductor element and the second semiconductor element fr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MATSUBARA, Hiroaki, NISHIOKA, Taro, OSUMI, Yoshizo
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MATSUBARA, Hiroaki
NISHIOKA, Taro
OSUMI, Yoshizo
description A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element electrically connected to the first semiconductor element and the second semiconductor element, and insulating the first semiconductor element and the second semiconductor element from each other; and a sealing resin covering the first semiconductor element, the second semiconductor element, and the insulating element. The sealing resin includes a first portion covering the first semiconductor element, the second semiconductor element, and the insulating element, and a second portion constituting the outermost surface of the sealing resin. The second portion is less prone to a tracking phenomenon than the first portion.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024304510A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024304510A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024304510A13</originalsourceid><addsrcrecordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRibGBiamhgaOhsbEqQIA-tQfiA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>MATSUBARA, Hiroaki ; NISHIOKA, Taro ; OSUMI, Yoshizo</creator><creatorcontrib>MATSUBARA, Hiroaki ; NISHIOKA, Taro ; OSUMI, Yoshizo</creatorcontrib><description>A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element electrically connected to the first semiconductor element and the second semiconductor element, and insulating the first semiconductor element and the second semiconductor element from each other; and a sealing resin covering the first semiconductor element, the second semiconductor element, and the insulating element. The sealing resin includes a first portion covering the first semiconductor element, the second semiconductor element, and the insulating element, and a second portion constituting the outermost surface of the sealing resin. The second portion is less prone to a tracking phenomenon than the first portion.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240912&amp;DB=EPODOC&amp;CC=US&amp;NR=2024304510A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240912&amp;DB=EPODOC&amp;CC=US&amp;NR=2024304510A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUBARA, Hiroaki</creatorcontrib><creatorcontrib>NISHIOKA, Taro</creatorcontrib><creatorcontrib>OSUMI, Yoshizo</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element electrically connected to the first semiconductor element and the second semiconductor element, and insulating the first semiconductor element and the second semiconductor element from each other; and a sealing resin covering the first semiconductor element, the second semiconductor element, and the insulating element. The sealing resin includes a first portion covering the first semiconductor element, the second semiconductor element, and the insulating element, and a second portion constituting the outermost surface of the sealing resin. The second portion is less prone to a tracking phenomenon than the first portion.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRibGBiamhgaOhsbEqQIA-tQfiA</recordid><startdate>20240912</startdate><enddate>20240912</enddate><creator>MATSUBARA, Hiroaki</creator><creator>NISHIOKA, Taro</creator><creator>OSUMI, Yoshizo</creator><scope>EVB</scope></search><sort><creationdate>20240912</creationdate><title>SEMICONDUCTOR DEVICE</title><author>MATSUBARA, Hiroaki ; NISHIOKA, Taro ; OSUMI, Yoshizo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024304510A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUBARA, Hiroaki</creatorcontrib><creatorcontrib>NISHIOKA, Taro</creatorcontrib><creatorcontrib>OSUMI, Yoshizo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUBARA, Hiroaki</au><au>NISHIOKA, Taro</au><au>OSUMI, Yoshizo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE</title><date>2024-09-12</date><risdate>2024</risdate><abstract>A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element electrically connected to the first semiconductor element and the second semiconductor element, and insulating the first semiconductor element and the second semiconductor element from each other; and a sealing resin covering the first semiconductor element, the second semiconductor element, and the insulating element. The sealing resin includes a first portion covering the first semiconductor element, the second semiconductor element, and the insulating element, and a second portion constituting the outermost surface of the sealing resin. The second portion is less prone to a tracking phenomenon than the first portion.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2024304510A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T08%3A06%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MATSUBARA,%20Hiroaki&rft.date=2024-09-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024304510A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true