HIGH THIXOTROPIC CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
A curable silicone composition comprising at least one curing reactive organopolysiloxane in an amount of 65% by weight or more relative to the total weight of the composition, at least one inorganic filler selected from silica, silica-titania composite oxide particle, and a combination thereof, in...
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| creator | TAKEUCHI, Shunya Kang, Hyunji IGUCHI, Yuri MATSUZAKI, Mayumi |
| description | A curable silicone composition comprising at least one curing reactive organopolysiloxane in an amount of 65% by weight or more relative to the total weight of the composition, at least one inorganic filler selected from silica, silica-titania composite oxide particle, and a combination thereof, in an amount of 1% by weight or more relative to the total weight of the composition, and at least one additive selected from (C1) organopolysiloxane having at least one organic functional group including at least one polyether structure at molecular side chain and/or molecular terminal; (C2) organosilane compound comprising at least one organic functional group selected from a C1-C6alkyl group, aryl group, and epoxy group, (C3) organopolysiloxane having at least one hydroxy group and at least one aryl group; (C4) organosiloxane oligomer having at least one epoxy group; (C5) unsaturated carboxylic acid or an ester thereof, and combinations thereof. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024301252A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024301252A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024301252A13</originalsourceid><addsrcrecordid>eNrjZHD38HT3UAjx8IzwDwnyD_B0VnAODXJ08nFVCPb08XT293NVcPb3DfAP9gzx9PdTcPRzASlwdVEICPJ3CXUOAWp1DXL1d-NhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRibGBoZGpkaOhsbEqQIAqH4tpQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HIGH THIXOTROPIC CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF</title><source>esp@cenet</source><creator>TAKEUCHI, Shunya ; Kang, Hyunji ; IGUCHI, Yuri ; MATSUZAKI, Mayumi</creator><creatorcontrib>TAKEUCHI, Shunya ; Kang, Hyunji ; IGUCHI, Yuri ; MATSUZAKI, Mayumi</creatorcontrib><description>A curable silicone composition comprising at least one curing reactive organopolysiloxane in an amount of 65% by weight or more relative to the total weight of the composition, at least one inorganic filler selected from silica, silica-titania composite oxide particle, and a combination thereof, in an amount of 1% by weight or more relative to the total weight of the composition, and at least one additive selected from (C1) organopolysiloxane having at least one organic functional group including at least one polyether structure at molecular side chain and/or molecular terminal; (C2) organosilane compound comprising at least one organic functional group selected from a C1-C6alkyl group, aryl group, and epoxy group, (C3) organopolysiloxane having at least one hydroxy group and at least one aryl group; (C4) organosiloxane oligomer having at least one epoxy group; (C5) unsaturated carboxylic acid or an ester thereof, and combinations thereof.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240912&DB=EPODOC&CC=US&NR=2024301252A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240912&DB=EPODOC&CC=US&NR=2024301252A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEUCHI, Shunya</creatorcontrib><creatorcontrib>Kang, Hyunji</creatorcontrib><creatorcontrib>IGUCHI, Yuri</creatorcontrib><creatorcontrib>MATSUZAKI, Mayumi</creatorcontrib><title>HIGH THIXOTROPIC CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF</title><description>A curable silicone composition comprising at least one curing reactive organopolysiloxane in an amount of 65% by weight or more relative to the total weight of the composition, at least one inorganic filler selected from silica, silica-titania composite oxide particle, and a combination thereof, in an amount of 1% by weight or more relative to the total weight of the composition, and at least one additive selected from (C1) organopolysiloxane having at least one organic functional group including at least one polyether structure at molecular side chain and/or molecular terminal; (C2) organosilane compound comprising at least one organic functional group selected from a C1-C6alkyl group, aryl group, and epoxy group, (C3) organopolysiloxane having at least one hydroxy group and at least one aryl group; (C4) organosiloxane oligomer having at least one epoxy group; (C5) unsaturated carboxylic acid or an ester thereof, and combinations thereof.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD38HT3UAjx8IzwDwnyD_B0VnAODXJ08nFVCPb08XT293NVcPb3DfAP9gzx9PdTcPRzASlwdVEICPJ3CXUOAWp1DXL1d-NhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRibGBoZGpkaOhsbEqQIAqH4tpQ</recordid><startdate>20240912</startdate><enddate>20240912</enddate><creator>TAKEUCHI, Shunya</creator><creator>Kang, Hyunji</creator><creator>IGUCHI, Yuri</creator><creator>MATSUZAKI, Mayumi</creator><scope>EVB</scope></search><sort><creationdate>20240912</creationdate><title>HIGH THIXOTROPIC CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF</title><author>TAKEUCHI, Shunya ; Kang, Hyunji ; IGUCHI, Yuri ; MATSUZAKI, Mayumi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024301252A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEUCHI, Shunya</creatorcontrib><creatorcontrib>Kang, Hyunji</creatorcontrib><creatorcontrib>IGUCHI, Yuri</creatorcontrib><creatorcontrib>MATSUZAKI, Mayumi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEUCHI, Shunya</au><au>Kang, Hyunji</au><au>IGUCHI, Yuri</au><au>MATSUZAKI, Mayumi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HIGH THIXOTROPIC CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF</title><date>2024-09-12</date><risdate>2024</risdate><abstract>A curable silicone composition comprising at least one curing reactive organopolysiloxane in an amount of 65% by weight or more relative to the total weight of the composition, at least one inorganic filler selected from silica, silica-titania composite oxide particle, and a combination thereof, in an amount of 1% by weight or more relative to the total weight of the composition, and at least one additive selected from (C1) organopolysiloxane having at least one organic functional group including at least one polyether structure at molecular side chain and/or molecular terminal; (C2) organosilane compound comprising at least one organic functional group selected from a C1-C6alkyl group, aryl group, and epoxy group, (C3) organopolysiloxane having at least one hydroxy group and at least one aryl group; (C4) organosiloxane oligomer having at least one epoxy group; (C5) unsaturated carboxylic acid or an ester thereof, and combinations thereof.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
| title | HIGH THIXOTROPIC CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF |
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