STRUCTURE WITH UPPER FEATURES OF ADJACENT METAL STRUCTURES WITH SIDEWALL SPACERS PROVIDING VOID-FREE DIELECTRIC FILLING

A structure includes a first metal structure including a first upper metal feature having a first sidewall spacer thereabout, and a first lower metal feature under the first upper metal feature. The first lower metal feature includes a sidewall devoid of the first sidewall spacer. The structure also...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kandasamy, Deepthi, You, Young Seon, Jang, Suk Hee, Ghosh, Abhijit, Lim, Yoke Leng
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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