MODULE

A module comprises: a first electronic component having a first component surface and a second component surface; a second electronic component having a third component surface and a fourth component surface; a first substrate having a first substrate surface and a second substrate surface; and a second substrate having a third substrate surface and a fourth substrate surface, the second substrate being disposed so as to overlap the first substrate while being spaced from the first substrate, the first electronic component and the second electronic component being disposed such that the second component surface and the third component surface face each other, at least a portion of the second electronic component being disposed inside an opening, the first electronic component being mounted on the second substrate surface by face bonding, the second electronic component being wire-bonded to the fourth substrate surface using a second connection terminal.