BACKSIDE GATE CONTACT, BACKSIDE GATE ETCH STOP LAYER, AND METHODS OF FORMING SAME

A semiconductor device includes a backside gate etch stop layer (ESL) on a backside of a first gate stack, wherein a plurality of first nanostructures overlaps the backside gate ESL. The backside gate ESL may comprise a high-k dielectric material. The semiconductor device further includes the plural...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ho, Wei-De, Liao, Szuya
Format: Patent
Sprache:eng
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