ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

An electronic package and a manufacturing method thereof are provided, in which a cover is disposed on a carrier structure having an electronic element, and the electronic element is covered by the cover. A magnetic conductive member is arranged between the cover and the electronic element, and an a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TSAI, Wen-Jung, LIN, Chien-Cheng, CHANG, Hui-Jing, CHIU, Chih-Hsien, TSAI, Ming-Fan, JENG, Cheng-You
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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