SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM

A substrate processing method includes: insolubilizing a resist pattern with respect to a phosphoric acid solution by irradiating a substrate, on which an organic film, a silicon-containing inorganic film, and the resist pattern are sequentially stacked in this order from below, with ultraviolet ray...

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Bibliographische Detailangaben
1. Verfasser:	OKADA, Soichiro
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A substrate processing method includes: insolubilizing a resist pattern with respect to a phosphoric acid solution by irradiating a substrate, on which an organic film, a silicon-containing inorganic film, and the resist pattern are sequentially stacked in this order from below, with ultraviolet rays; after the insolubilizing the resist pattern, removing the silicon-containing inorganic film exposed from the resist pattern by supplying the phosphoric acid solution to the substrate; and after the removing the silicon-containing inorganic film, transferring the resist pattern to the organic film by performing an etching process on the substrate.