Structure and Method of Forming a Joint Assembly

A method of manufacturing a semiconductor device structure includes forming a bond or joint between a first device and a second device. The first device comprises an integrated passive device (IPD) and a first contact pad disposed over the IPD. The second device comprises a second contact pad. The f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yu, Chen-Hua, Chen, Hsien-Wei, Chen, Ying-Ju, Su, An-Jhih, Wu, Chi-Hsi, Yeh, Der-Chyang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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