POWER MODULE

A multilayer substrate for a power module is provided. The multilayer substrate may include a copper tile soldered between an integrated circuit component and a direct bonded copper assembly in order to facilitate heat dissipation from the integrated circuit component.

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Bibliographische Detailangaben
Hauptverfasser:	Chowdhury, Md Shajjad, Gurpinar, Emre, Ozpineci, Burak
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A multilayer substrate for a power module is provided. The multilayer substrate may include a copper tile soldered between an integrated circuit component and a direct bonded copper assembly in order to facilitate heat dissipation from the integrated circuit component.