POLISHING APPARATUS

A polishing apparatus that can improve an accuracy of position coordinates associated with a measured value of film thickness is disclosed. The polishing apparatus includes: a pad-thickness measuring device configured to measure a thickness of the polishing pad; an optical film-thickness measuring d...

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Hauptverfasser:	SHIOKAWA, Yoichi, WATANABE, Yuki, TANOUE, Keita, KINOSHITA, Masaki, KIMBA, Toshifumi
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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creator	SHIOKAWA, Yoichi WATANABE, Yuki TANOUE, Keita KINOSHITA, Masaki KIMBA, Toshifumi
description	A polishing apparatus that can improve an accuracy of position coordinates associated with a measured value of film thickness is disclosed. The polishing apparatus includes: a pad-thickness measuring device configured to measure a thickness of the polishing pad; an optical film-thickness measuring device configured to emit light obliquely to the substrate, and determine measured values of film thickness at measurement points; and a controller configured to associates the measured values of the film thickness with measurement coordinates indicating positions of the measurement points. The controller is configured to determine amount of movement of the measurement coordinates corresponding to a measured value of the thickness of the polishing pad based on correlation data indicating a relationship between the thickness of the polishing pad and the amount of movement of the measurement coordinates; and correct the measurement coordinates associated with the measured values of the film thickness based on the determined amount of movement of the measurement coordinates.
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The polishing apparatus includes: a pad-thickness measuring device configured to measure a thickness of the polishing pad; an optical film-thickness measuring device configured to emit light obliquely to the substrate, and determine measured values of film thickness at measurement points; and a controller configured to associates the measured values of the film thickness with measurement coordinates indicating positions of the measurement points. 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The controller is configured to determine amount of movement of the measurement coordinates corresponding to a measured value of the thickness of the polishing pad based on correlation data indicating a relationship between the thickness of the polishing pad and the amount of movement of the measurement coordinates; and correct the measurement coordinates associated with the measured values of the film thickness based on the determined amount of movement of the measurement coordinates.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAO8PfxDPbw9HNXcAwIcAxyDAkN5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGJkbmFsbmFo6GxsSpAgDm3R-C</recordid><startdate>20240822</startdate><enddate>20240822</enddate><creator>SHIOKAWA, Yoichi</creator><creator>WATANABE, Yuki</creator><creator>TANOUE, Keita</creator><creator>KINOSHITA, Masaki</creator><creator>KIMBA, Toshifumi</creator><scope>EVB</scope></search><sort><creationdate>20240822</creationdate><title>POLISHING APPARATUS</title><author>SHIOKAWA, Yoichi ; WATANABE, Yuki ; TANOUE, Keita ; KINOSHITA, Masaki ; KIMBA, Toshifumi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024278378A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIOKAWA, Yoichi</creatorcontrib><creatorcontrib>WATANABE, Yuki</creatorcontrib><creatorcontrib>TANOUE, Keita</creatorcontrib><creatorcontrib>KINOSHITA, Masaki</creatorcontrib><creatorcontrib>KIMBA, Toshifumi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIOKAWA, Yoichi</au><au>WATANABE, Yuki</au><au>TANOUE, Keita</au><au>KINOSHITA, Masaki</au><au>KIMBA, Toshifumi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING APPARATUS</title><date>2024-08-22</date><risdate>2024</risdate><abstract>A polishing apparatus that can improve an accuracy of position coordinates associated with a measured value of film thickness is disclosed. 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subjects	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
title	POLISHING APPARATUS
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