SUBMODULE

The present disclosure relates to a submodule. An enclosure 20 may form the exterior of the submodule 10 of the present disclosure. A first opening 25 may be formed on one side surface 24 of the enclosure 20. A heat sink 30 may be installed in the first opening 25. The inner surface of the heat sink...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JUNG, Hong Ju, HONG, Jung Won, PARK, Yong Hee, KU, Nam Joon, KWON, Ki Ryang
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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