SUBMODULE

The present disclosure relates to a submodule. An enclosure 20 may form the exterior of the submodule 10 of the present disclosure. A first opening 25 may be formed on one side surface 24 of the enclosure 20. A heat sink 30 may be installed in the first opening 25. The inner surface of the heat sink...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG, Hong Ju, HONG, Jung Won, PARK, Yong Hee, KU, Nam Joon, KWON, Ki Ryang
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present disclosure relates to a submodule. An enclosure 20 may form the exterior of the submodule 10 of the present disclosure. A first opening 25 may be formed on one side surface 24 of the enclosure 20. A heat sink 30 may be installed in the first opening 25. The inner surface of the heat sink 30 faces the inside of the enclosure 20, and the outer surface of the heat sink 30 may form one outer surface of the enclosure 20. A heating element such as a power semiconductor 32 or a control board may be installed on the heat sink 30. An inlet 34 and an outlet 36 may be provided at one side edge of the heat sink 30 to communicate with a flow path formed therein and allow cooling fluid to flow in and out.