SEMICONDUCTOR CHIP AND COMPONENT

SEMICONDUCTOR CHIP AND COMPONENT

A semiconductor chip with a structured chip back side is specified, the chip back side being configured for electrical and thermal linking of the semiconductor chip, the semiconductor chip having emitter regions configured for producing electromagnetic radiation and the structured chip back side hav...

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Hauptverfasser: SORG, Jörg Erich, KIPPES, Thomas, HEIDEMANN, Matthias, SCHLEGL, Sebastian, HEINEMANN, Erik, SOMERS, André
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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creator SORG, Jörg Erich
KIPPES, Thomas
HEIDEMANN, Matthias
SCHLEGL, Sebastian
HEINEMANN, Erik
SOMERS, André
description A semiconductor chip with a structured chip back side is specified, the chip back side being configured for electrical and thermal linking of the semiconductor chip, the semiconductor chip having emitter regions configured for producing electromagnetic radiation and the structured chip back side having connection pads configured for electrical linking of the emitter regions. The connection pads are p-contacts or n-contacts, with, in a plan view, all connection pads (which are configured either as p-contacts or as n-contacts overlapping with at least two of the emitter regions in each case and each of these connection pads being configured for electrical linking of only one of the emitter regions. Moreover, a component is specified, in particular comprising at least one such semiconductor chip.
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subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
title SEMICONDUCTOR CHIP AND COMPONENT
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