Forming Source And Drain Features In Semiconductor Devices

A method includes forming a first portion of a spacer layer over a first fin and a second portion of the spacer layer over a second fin, performing a first etching process to recess the first portion of the spacer layer with respect to the second portion of the spacer layer to form first spacers on...

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Bibliographische Detailangaben
Hauptverfasser: LO, Dave, LIAO, Chih-Teng, WANG, Shu Wen, HSIEH, Jui Fu, CHEN, Chih-Shan
Format: Patent
Sprache:eng
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