INTEGRATED CIRCUIT DIE PAD CAVITY

An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes an electrically conductive pad having a generally planar top surface that includes a cavity having a bottom surface and sidewalls extending from the bottom surface of the cavity to the top s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chien, Yuh-Harng, Chou, Hung-Yu, Lin, Chung-Hao, Pan, Bo-Hsun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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