SOLDER MOUNTING LAND AND CHARGER

A solder mounting land according to the present disclosure is a land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering. The solder mounting land includes a first region and a second region. The first region is a regions to which...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HOSOI, Hiroyuki
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!