SOLDER MOUNTING LAND AND CHARGER
A solder mounting land according to the present disclosure is a land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering. The solder mounting land includes a first region and a second region. The first region is a regions to which...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HOSOI, Hiroyuki |
| description | A solder mounting land according to the present disclosure is a land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering. The solder mounting land includes a first region and a second region. The first region is a regions to which the electronic component is bonded. The second region is a region protruding from a part of a peripheral edge portion of the first region in a direction in which the first region is extended in plan view. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024268024A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024268024A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024268024A13</originalsourceid><addsrcrecordid>eNrjZFAI9vdxcQ1S8PUP9Qvx9HNX8HH0c1EAYWcPxyB31yAeBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhIfGmxkYGRiZGYBJB0NjYlTBQBqUiKf</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SOLDER MOUNTING LAND AND CHARGER</title><source>esp@cenet</source><creator>HOSOI, Hiroyuki</creator><creatorcontrib>HOSOI, Hiroyuki</creatorcontrib><description>A solder mounting land according to the present disclosure is a land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering. The solder mounting land includes a first region and a second region. The first region is a regions to which the electronic component is bonded. The second region is a region protruding from a part of a peripheral edge portion of the first region in a direction in which the first region is extended in plan view.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC EQUIPMENT OR PROPULSION OF ELECTRICALLY-PROPELLEDVEHICLES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES, IN GENERAL ; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING ; VEHICLES IN GENERAL</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240808&DB=EPODOC&CC=US&NR=2024268024A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240808&DB=EPODOC&CC=US&NR=2024268024A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOSOI, Hiroyuki</creatorcontrib><title>SOLDER MOUNTING LAND AND CHARGER</title><description>A solder mounting land according to the present disclosure is a land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering. The solder mounting land includes a first region and a second region. The first region is a regions to which the electronic component is bonded. The second region is a region protruding from a part of a peripheral edge portion of the first region in a direction in which the first region is extended in plan view.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC EQUIPMENT OR PROPULSION OF ELECTRICALLY-PROPELLEDVEHICLES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES, IN GENERAL</subject><subject>MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><subject>VEHICLES IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAI9vdxcQ1S8PUP9Qvx9HNX8HH0c1EAYWcPxyB31yAeBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhIfGmxkYGRiZGYBJB0NjYlTBQBqUiKf</recordid><startdate>20240808</startdate><enddate>20240808</enddate><creator>HOSOI, Hiroyuki</creator><scope>EVB</scope></search><sort><creationdate>20240808</creationdate><title>SOLDER MOUNTING LAND AND CHARGER</title><author>HOSOI, Hiroyuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024268024A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC EQUIPMENT OR PROPULSION OF ELECTRICALLY-PROPELLEDVEHICLES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES, IN GENERAL</topic><topic>MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><topic>VEHICLES IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>HOSOI, Hiroyuki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOSOI, Hiroyuki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLDER MOUNTING LAND AND CHARGER</title><date>2024-08-08</date><risdate>2024</risdate><abstract>A solder mounting land according to the present disclosure is a land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering. The solder mounting land includes a first region and a second region. The first region is a regions to which the electronic component is bonded. The second region is a region protruding from a part of a peripheral edge portion of the first region in a direction in which the first region is extended in plan view.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2024268024A1 |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC EQUIPMENT OR PROPULSION OF ELECTRICALLY-PROPELLEDVEHICLES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES, IN GENERAL MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING VEHICLES IN GENERAL |
| title | SOLDER MOUNTING LAND AND CHARGER |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T17%3A04%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HOSOI,%20Hiroyuki&rft.date=2024-08-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024268024A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |