SEMICONDUCTOR DEVICE

A semiconductor device includes a semiconductor element, a terminal to which a wire is coupled, a housing surrounding the semiconductor element and a coupling portion of the terminal, the coupling portion of the terminal being coupled to the wire, and an encapsulant sealing an internal space surroun...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KANAI, Naoyuki, SAITO, Mai
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KANAI, Naoyuki
SAITO, Mai
description A semiconductor device includes a semiconductor element, a terminal to which a wire is coupled, a housing surrounding the semiconductor element and a coupling portion of the terminal, the coupling portion of the terminal being coupled to the wire, and an encapsulant sealing an internal space surrounded by the housing, in which the terminal includes a recess-shaped or protrusion-shaped coupling region coupled to the wire.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024266265A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024266265A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024266265A13</originalsourceid><addsrcrecordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRiZGZmZGZqaOhsbEqQIA_YgfpA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>KANAI, Naoyuki ; SAITO, Mai</creator><creatorcontrib>KANAI, Naoyuki ; SAITO, Mai</creatorcontrib><description>A semiconductor device includes a semiconductor element, a terminal to which a wire is coupled, a housing surrounding the semiconductor element and a coupling portion of the terminal, the coupling portion of the terminal being coupled to the wire, and an encapsulant sealing an internal space surrounded by the housing, in which the terminal includes a recess-shaped or protrusion-shaped coupling region coupled to the wire.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240808&amp;DB=EPODOC&amp;CC=US&amp;NR=2024266265A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240808&amp;DB=EPODOC&amp;CC=US&amp;NR=2024266265A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANAI, Naoyuki</creatorcontrib><creatorcontrib>SAITO, Mai</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>A semiconductor device includes a semiconductor element, a terminal to which a wire is coupled, a housing surrounding the semiconductor element and a coupling portion of the terminal, the coupling portion of the terminal being coupled to the wire, and an encapsulant sealing an internal space surrounded by the housing, in which the terminal includes a recess-shaped or protrusion-shaped coupling region coupled to the wire.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRiZGZmZGZqaOhsbEqQIA_YgfpA</recordid><startdate>20240808</startdate><enddate>20240808</enddate><creator>KANAI, Naoyuki</creator><creator>SAITO, Mai</creator><scope>EVB</scope></search><sort><creationdate>20240808</creationdate><title>SEMICONDUCTOR DEVICE</title><author>KANAI, Naoyuki ; SAITO, Mai</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024266265A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KANAI, Naoyuki</creatorcontrib><creatorcontrib>SAITO, Mai</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANAI, Naoyuki</au><au>SAITO, Mai</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE</title><date>2024-08-08</date><risdate>2024</risdate><abstract>A semiconductor device includes a semiconductor element, a terminal to which a wire is coupled, a housing surrounding the semiconductor element and a coupling portion of the terminal, the coupling portion of the terminal being coupled to the wire, and an encapsulant sealing an internal space surrounded by the housing, in which the terminal includes a recess-shaped or protrusion-shaped coupling region coupled to the wire.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2024266265A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T10%3A09%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KANAI,%20Naoyuki&rft.date=2024-08-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024266265A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true