ELECTRONIC DEVICE COOLING STRUCTURES

A cooling structure having a first side and a second side opposite the first side can be formed through a method comprising, forming an inlet and an outlet in a first substrate, forming at least one channel on the second side of the first substrate, wherein the at least one channel is in fluid commu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HABA, Belgacem, ZHANG, Ron, FOUNTAIN, JR., Gaius Gillman, BANG, Kyong-Mo, WORKMAN, Thomas
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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