CHIP ON FILMS AND DISPLAY DEVICES

CHIP ON FILMS AND DISPLAY DEVICES

Display devices and chip on films are provided. The chip on film includes a display bonding area corresponding to bonding positions of a display panel, and includes a base and bonding terminals disposed on the base. In the display bonding area, the base includes first and second bonding portions, wh...

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Hauptverfasser: WANG, Jiajie, JIANG, Yingchuan, WU, Xiaomin, XIANYU, Wenxu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator WANG, Jiajie
JIANG, Yingchuan
WU, Xiaomin
XIANYU, Wenxu
description Display devices and chip on films are provided. The chip on film includes a display bonding area corresponding to bonding positions of a display panel, and includes a base and bonding terminals disposed on the base. In the display bonding area, the base includes first and second bonding portions, which are provided with the bonding terminals thereon. The first bonding portion has an outer contour and includes one part of outer edges of the base. The second bonding portion includes one or more first sub-portions including the other part of the outer edges of the base, and the first sub-portions are concave and/or convex relative to the outer contour; and/or the base further includes one or more hollow portions, the second bonding portion includes one or more second sub-portions, and each of the second sub-portions includes inner edges of the base surrounding one of the hollow portions.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title CHIP ON FILMS AND DISPLAY DEVICES
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