METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE

An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surf...

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Hauptverfasser:	BANG, Won Bae, CHUNG, Ji Young, KIM, Byong Jin, KIM, Gi Jeong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS COFFEE MILLS DOMESTIC ARTICLES OR APPLIANCES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNITURE HOUSEHOLD OR TABLE EQUIPMENT HUMAN NECESSITIES SEMICONDUCTOR DEVICES SPICE MILLS SUCTION CLEANERS IN GENERAL
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creator	BANG, Won Bae CHUNG, Ji Young KIM, Byong Jin KIM, Gi Jeong
description	An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.
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subjects	BASIC ELECTRIC ELEMENTS COFFEE MILLS DOMESTIC ARTICLES OR APPLIANCES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNITURE HOUSEHOLD OR TABLE EQUIPMENT HUMAN NECESSITIES SEMICONDUCTOR DEVICES SPICE MILLS SUCTION CLEANERS IN GENERAL
title	METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE
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