LASER PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A laser processing apparatus includes a stage having a wafer holding surface, a laser irradiation mechanism, and a nozzle. On the wafer holding surface, a semiconductor wafer having a first surface and a second surface opposite to the first surface is disposed such that the wafer holding surface fac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUMURA, Tamio, KAMOSHIDA, Ryo
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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