ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

In one example, an electronic device includes a substrate including a substrate upper side and a conductive structure comprising substrate upper terminals adjacent to the substrate upper side. Vertical interconnects are coupled to the substrate upper terminals. An encapsulant covers portions of the substrate and the vertical interconnects. The vertical interconnects are exposed from an upper side of the encapsulant. A redistribution structure is over the encapsulant and includes a redistribution structure upper side, a redistribution structure lower side, a redistribution dielectric structure, and a redistribution conductive structure. The redistribution structure includes redistribution upper terminals adjacent to the redistribution structure upper side and redistribution bottom terminals adjacent to the redistribution lower side. The redistribution bottom terminals are coupled to the vertical interconnects and the redistribution upper terminals. An electronic component is coupled to the redistribution upper terminals. Other examples and related methods are also disclosed herein.