SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

A substrate processing system that performs substrate processing includes: a first processing system having one of a wet processing apparatus and a dry processing apparatus; a second processing system having the other one of the wet processing apparatus and the dry processing apparatus, wherein the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TERAMOTO, Akihiro, TAKAKI, Shinsuke, NAKASHIMA, Seiji, SHOBU, Ryo
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator TERAMOTO, Akihiro
TAKAKI, Shinsuke
NAKASHIMA, Seiji
SHOBU, Ryo
description A substrate processing system that performs substrate processing includes: a first processing system having one of a wet processing apparatus and a dry processing apparatus; a second processing system having the other one of the wet processing apparatus and the dry processing apparatus, wherein the first processing system includes a common stage, which is common to the first processing system and the second processing system and is configured to place thereon a container accommodating substrates before being subjected to the substrate processing, wherein the substrate processing system further includes: a first transfer system configured to transfer the substrates between the first processing system and the second processing system; and a second transfer system connected to at least the second processing system, and configured to transfer the substrates between the first processing system and the second processing system, or between another stage and the second processing system.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024249964A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024249964A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024249964A13</originalsourceid><addsrcrecordid>eNrjZLAODnUKDglyDHFVCAjyd3YNDvb0c1cIjgwOcfVVcPRzUcAq7-sa4uHvwsPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4kODjQyMTIxMLC3NTBwNjYlTBQDKXCrX</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD</title><source>esp@cenet</source><creator>TERAMOTO, Akihiro ; TAKAKI, Shinsuke ; NAKASHIMA, Seiji ; SHOBU, Ryo</creator><creatorcontrib>TERAMOTO, Akihiro ; TAKAKI, Shinsuke ; NAKASHIMA, Seiji ; SHOBU, Ryo</creatorcontrib><description>A substrate processing system that performs substrate processing includes: a first processing system having one of a wet processing apparatus and a dry processing apparatus; a second processing system having the other one of the wet processing apparatus and the dry processing apparatus, wherein the first processing system includes a common stage, which is common to the first processing system and the second processing system and is configured to place thereon a container accommodating substrates before being subjected to the substrate processing, wherein the substrate processing system further includes: a first transfer system configured to transfer the substrates between the first processing system and the second processing system; and a second transfer system connected to at least the second processing system, and configured to transfer the substrates between the first processing system and the second processing system, or between another stage and the second processing system.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240725&amp;DB=EPODOC&amp;CC=US&amp;NR=2024249964A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240725&amp;DB=EPODOC&amp;CC=US&amp;NR=2024249964A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TERAMOTO, Akihiro</creatorcontrib><creatorcontrib>TAKAKI, Shinsuke</creatorcontrib><creatorcontrib>NAKASHIMA, Seiji</creatorcontrib><creatorcontrib>SHOBU, Ryo</creatorcontrib><title>SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD</title><description>A substrate processing system that performs substrate processing includes: a first processing system having one of a wet processing apparatus and a dry processing apparatus; a second processing system having the other one of the wet processing apparatus and the dry processing apparatus, wherein the first processing system includes a common stage, which is common to the first processing system and the second processing system and is configured to place thereon a container accommodating substrates before being subjected to the substrate processing, wherein the substrate processing system further includes: a first transfer system configured to transfer the substrates between the first processing system and the second processing system; and a second transfer system connected to at least the second processing system, and configured to transfer the substrates between the first processing system and the second processing system, or between another stage and the second processing system.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAODnUKDglyDHFVCAjyd3YNDvb0c1cIjgwOcfVVcPRzUcAq7-sa4uHvwsPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4kODjQyMTIxMLC3NTBwNjYlTBQDKXCrX</recordid><startdate>20240725</startdate><enddate>20240725</enddate><creator>TERAMOTO, Akihiro</creator><creator>TAKAKI, Shinsuke</creator><creator>NAKASHIMA, Seiji</creator><creator>SHOBU, Ryo</creator><scope>EVB</scope></search><sort><creationdate>20240725</creationdate><title>SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD</title><author>TERAMOTO, Akihiro ; TAKAKI, Shinsuke ; NAKASHIMA, Seiji ; SHOBU, Ryo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024249964A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TERAMOTO, Akihiro</creatorcontrib><creatorcontrib>TAKAKI, Shinsuke</creatorcontrib><creatorcontrib>NAKASHIMA, Seiji</creatorcontrib><creatorcontrib>SHOBU, Ryo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TERAMOTO, Akihiro</au><au>TAKAKI, Shinsuke</au><au>NAKASHIMA, Seiji</au><au>SHOBU, Ryo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD</title><date>2024-07-25</date><risdate>2024</risdate><abstract>A substrate processing system that performs substrate processing includes: a first processing system having one of a wet processing apparatus and a dry processing apparatus; a second processing system having the other one of the wet processing apparatus and the dry processing apparatus, wherein the first processing system includes a common stage, which is common to the first processing system and the second processing system and is configured to place thereon a container accommodating substrates before being subjected to the substrate processing, wherein the substrate processing system further includes: a first transfer system configured to transfer the substrates between the first processing system and the second processing system; and a second transfer system connected to at least the second processing system, and configured to transfer the substrates between the first processing system and the second processing system, or between another stage and the second processing system.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2024249964A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T12%3A26%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TERAMOTO,%20Akihiro&rft.date=2024-07-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024249964A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true