AI ENHANCED, SELF CORRECTING AND CLOSED LOOP SMT MANUFACTURING SYSTEM

An AI enhanced self-correcting and closed loop SMT manufacturing system for fabricating PCBAs. The system includes a screen printer for depositing solder paste on solder pads on a RGB, an SRI sub-system for inspecting the solder paste deposited on the PCB to identify defects, a pick-and-place machin...

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Hauptverfasser:	Tokotch, Nicholas Randall, Mohammed, Anwar A, Rojo, Gary, Singh, Harpuneet, Lowell, Bonnie
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS PRINTED CIRCUITS REGULATING
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creator	Tokotch, Nicholas Randall Mohammed, Anwar A Rojo, Gary Singh, Harpuneet Lowell, Bonnie
description	An AI enhanced self-correcting and closed loop SMT manufacturing system for fabricating PCBAs. The system includes a screen printer for depositing solder paste on solder pads on a RGB, an SRI sub-system for inspecting the solder paste deposited on the PCB to identify defects, a pick-and-place machine for placing circuit components on the solder paste, an AOI sub-system for inspecting the PCB after the circuit components are placed on the PCB, and a reflow soldering oven for bonding component leads both electrically and mechanically to the pads on the PCB. An AI/ML analysis engine is responsive to process data and variables from each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven and provides downstream feedback signals to each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven for self-correction purposes.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024248463A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024248463A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024248463A13</originalsourceid><addsrcrecordid>eNrjZHB19FRw9fNw9HN2ddFRCHb1cVNw9g8KcnUO8fRzV3D0c1Fw9vEPdnVR8PH3D1AI9g1R8HX0C3VzdA4JDQKpCI4MDnH15WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGJkYmFiZmxo6GxsSpAgADxCzA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>AI ENHANCED, SELF CORRECTING AND CLOSED LOOP SMT MANUFACTURING SYSTEM</title><source>esp@cenet</source><creator>Tokotch, Nicholas Randall ; Mohammed, Anwar A ; Rojo, Gary ; Singh, Harpuneet ; Lowell, Bonnie</creator><creatorcontrib>Tokotch, Nicholas Randall ; Mohammed, Anwar A ; Rojo, Gary ; Singh, Harpuneet ; Lowell, Bonnie</creatorcontrib><description>An AI enhanced self-correcting and closed loop SMT manufacturing system for fabricating PCBAs. The system includes a screen printer for depositing solder paste on solder pads on a RGB, an SRI sub-system for inspecting the solder paste deposited on the PCB to identify defects, a pick-and-place machine for placing circuit components on the solder paste, an AOI sub-system for inspecting the PCB after the circuit components are placed on the PCB, and a reflow soldering oven for bonding component leads both electrically and mechanically to the pads on the PCB. An AI/ML analysis engine is responsive to process data and variables from each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven and provides downstream feedback signals to each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven for self-correction purposes.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONTROL OR REGULATING SYSTEMS IN GENERAL ; CONTROLLING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ; PHYSICS ; PRINTED CIRCUITS ; REGULATING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240725&DB=EPODOC&CC=US&NR=2024248463A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240725&DB=EPODOC&CC=US&NR=2024248463A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Tokotch, Nicholas Randall</creatorcontrib><creatorcontrib>Mohammed, Anwar A</creatorcontrib><creatorcontrib>Rojo, Gary</creatorcontrib><creatorcontrib>Singh, Harpuneet</creatorcontrib><creatorcontrib>Lowell, Bonnie</creatorcontrib><title>AI ENHANCED, SELF CORRECTING AND CLOSED LOOP SMT MANUFACTURING SYSTEM</title><description>An AI enhanced self-correcting and closed loop SMT manufacturing system for fabricating PCBAs. The system includes a screen printer for depositing solder paste on solder pads on a RGB, an SRI sub-system for inspecting the solder paste deposited on the PCB to identify defects, a pick-and-place machine for placing circuit components on the solder paste, an AOI sub-system for inspecting the PCB after the circuit components are placed on the PCB, and a reflow soldering oven for bonding component leads both electrically and mechanically to the pads on the PCB. An AI/ML analysis engine is responsive to process data and variables from each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven and provides downstream feedback signals to each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven for self-correction purposes.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONTROL OR REGULATING SYSTEMS IN GENERAL</subject><subject>CONTROLLING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>REGULATING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB19FRw9fNw9HN2ddFRCHb1cVNw9g8KcnUO8fRzV3D0c1Fw9vEPdnVR8PH3D1AI9g1R8HX0C3VzdA4JDQKpCI4MDnH15WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGJkYmFiZmxo6GxsSpAgADxCzA</recordid><startdate>20240725</startdate><enddate>20240725</enddate><creator>Tokotch, Nicholas Randall</creator><creator>Mohammed, Anwar A</creator><creator>Rojo, Gary</creator><creator>Singh, Harpuneet</creator><creator>Lowell, Bonnie</creator><scope>EVB</scope></search><sort><creationdate>20240725</creationdate><title>AI ENHANCED, SELF CORRECTING AND CLOSED LOOP SMT MANUFACTURING SYSTEM</title><author>Tokotch, Nicholas Randall ; Mohammed, Anwar A ; Rojo, Gary ; Singh, Harpuneet ; Lowell, Bonnie</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024248463A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONTROL OR REGULATING SYSTEMS IN GENERAL</topic><topic>CONTROLLING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>REGULATING</topic><toplevel>online_resources</toplevel><creatorcontrib>Tokotch, Nicholas Randall</creatorcontrib><creatorcontrib>Mohammed, Anwar A</creatorcontrib><creatorcontrib>Rojo, Gary</creatorcontrib><creatorcontrib>Singh, Harpuneet</creatorcontrib><creatorcontrib>Lowell, Bonnie</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tokotch, Nicholas Randall</au><au>Mohammed, Anwar A</au><au>Rojo, Gary</au><au>Singh, Harpuneet</au><au>Lowell, Bonnie</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>AI ENHANCED, SELF CORRECTING AND CLOSED LOOP SMT MANUFACTURING SYSTEM</title><date>2024-07-25</date><risdate>2024</risdate><abstract>An AI enhanced self-correcting and closed loop SMT manufacturing system for fabricating PCBAs. The system includes a screen printer for depositing solder paste on solder pads on a RGB, an SRI sub-system for inspecting the solder paste deposited on the PCB to identify defects, a pick-and-place machine for placing circuit components on the solder paste, an AOI sub-system for inspecting the PCB after the circuit components are placed on the PCB, and a reflow soldering oven for bonding component leads both electrically and mechanically to the pads on the PCB. An AI/ML analysis engine is responsive to process data and variables from each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven and provides downstream feedback signals to each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven for self-correction purposes.</abstract><oa>free_for_read</oa></addata></record>
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS PRINTED CIRCUITS REGULATING
title	AI ENHANCED, SELF CORRECTING AND CLOSED LOOP SMT MANUFACTURING SYSTEM
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T07%3A51%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Tokotch,%20Nicholas%20Randall&rft.date=2024-07-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024248463A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true